Unicomp X Ray
Hochauflösender FPD-Detektor BGA Head-In-Pillow Defect AX9500 Unicomp SMT-Schweißanalysesystem
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...
7-Achsen-3D-Rekonstruktion, überarbeitete PCBA-BGA-Röntgeninspektionsmaschine AX9500 Unicomp
AX9500 UNICOMP 7-Axis 3D Reconstruction X-Ray Inspection Machine High-precision CT system for accurate PCB and BGA inspection with advanced 3D tomography capabilities. Advanced Inspection Capabilities CT detection for BGA, CSP, flip chips, LEDs and other semiconductors SMT welding analysis and ...
2D/2,5D/3D All-in-One-Bildgebung 160 kV Open Tube Semiconductor BGA AX9500 Unicomp Post-Rework PCBA QC-Scanner
AX9500 UNICOMP X-Ray Computed Tomography System High-precision 2D/2.5D/3D all-in-one imaging system for accurate PCB and BGA inspection with 160kV open tube technology. Advanced Inspection Capabilities Fully upgraded system capable of CT detection on BGA, CSP, flip chips, LEDs and other semiconducto...
Hochauflösendes FPD SMT BGA Verpackungs-Röntgeninspektionsgerät AX9500 Unicomp
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2...
Echtzeit-Unicomp-Röntgengerät 1,2 kW AX9100 für die Elektronikmontage
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
7µM Mikrofokus-Röhren-Röntgengerät AX9100 für CSP EMS BGA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1280(L)x1510(W)x1700(H)mm Weight 1750kg Power 220AC/50Hz Power Consumption 1.2kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 65W ...
Multimode-3D-7-Achsen-PCBA-Röntgeninspektionsgerät AX9500 Unicomp
Multi-mode 3D 7-axis PCBA X-ray Inspection Machine AX9500 Unicomp Fully upgraded new product capable of performing CT detection on BGA, CSP, flip chips, LEDs and other semiconductors. Also suitable for SMT welding analysis with 3D tomography CT scanning system (planar CT + cone beam CT). Application...
160-kV-Röntgeninspektionsgerät für PCBA-BGA-Lötverbindungen mit offener Röhre AX9500 Unicomp Head-In-Pillow
160kV Open Tube PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Head-In-Pillow High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other ...
