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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9500
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 300 Sätze pro Monat
Produktübersicht
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

Produktdetails

Hervorheben:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: Unicomp-Röntgenprüfungs-Maschine
Application: SMT, EMS, BGA, Elektronik, CSP, LED, Flip Chip, Halbleiter
Industry: Elektronik-Industrie
X-Ray Leakage: < 1uSv="">
Produktbeschreibung
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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