x ray detector
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Strahln-Inspektionsmaschine der Nahrung X für die Prüfung von Auslandsangelegenheiten innerhalb des Frischfleisches mit Selbstausstoßer
Food X ray inspection machine for checking foreign matters inside fresh meat with auto rejector APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass,
Unicomp-Fabrikversorgung des Röntgenprüfungs-Systems für Nahrungsmittelverseuchung Inspektion
Unicomp factory supply of X-ray Inspection System for food contamination Inspection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone, shell
UNX 4015 Röntgensystem für Garnelen, Süßigkeiten, Gemüse, Geflügel, Teigtaschen
UNX 4015 X-ray system for Prawn candy vegetable poultry dumplings foreign matters detection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
110-kV-Hochpräzisions-IC-Halbleiterkomponenten-Röntgengerät mit versiegelter Röhre AX8300MAX Unicomp-Qualitätskontrolle
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
360° Rotation CNC Automatische MOSFET-Leiterplattenbestückung Röntgeninspektionssystem AX8300MAX Unicomp Stabile Leistung
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
5 μm 110 kV versiegeltes Röhren-IC-Halbleiterelektronik-Röntgeninspektionsgerät AX8300 Unicomp Hohe Präzision
5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance gap between standard 90kV and 130kV systems. It delivers balanced penetration power, perfectly suited for scenarios where 90kV is insufficient and 130kV is overly powerful. Powered
Unicomp AX7900 90KV 2D-Röntgensystem für die genaue Erkennung von BGA-Leerstellen
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
22" Defekt-elektronische Inspektions-Ausrüstungs-hohe Auflösung LCD-Monitor SMTs EMS lötende
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Lithium-Batterie-Inspektions-Maschine AX8800 0.2mA CSP 5KW
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø
