x ray detection systems
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Elektronische Platten 2D & 2.5D Röntgenmaschine AX9100MAX mit 360-Grad-Rotationstisch für BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
IC-Kurvmessung Unicomp AX9100MAX Röntgenmaschine mit 84μm Pixelgröße und 60° Neigungswinkel
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT-PCB-Röntgenmaschine Unicomp AX9100MAX hochauflösende Mikronenfokus-Punktgröße für BGA-Leere und Lötpasteinspektion
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130-KV Mikron-Fokus-Punktgröße Röntgengerät Unicomp AX9100 Modernisiertes Modell AX9100MAX mit Dual-Computern für PCB&BGA-Inspektion
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Hochspezifische elektronische Platten 2D & 2.5D Röntgenmaschine Unicomp AX9100MAX mit 360-Grad-Rotationstisch für BGA und PCB-Inspektion
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Maschinen-vielseitiges System Wechselstroms 110-220V Elektronik-X Ray für Halbleiterchip, PFEILER
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
Maschinen-hohe Genauigkeits-Inspektion UNC160 X Ray Automobilteile zerstörungsfreier Prüfung industrielle
Automotive Parts NDT Industrial X Ray Machine High Accuracy Inspection UNC160 1. Reliable inspection decisions based on outstanding image quality 2. High-speed wheel inspection of the heaviest wheels with our new gripper manipulator 3. Automatic inspection software for a reliable, objective inspection decision and low pseudo reject numbers 4. Revolving in/out-feed doors for high throughput at maximum up-time and minimum maintenance costs 5. Automatic calibration, eliminating
Zylinder-duktiles Eisen UNC450 Unicomp industrielle X Ray des Stahlrohr-450KV Maschine
450KV Steel Pipe Cylinder Industrial X Ray Machine Unicomp Ductile Iron UNC450 It is widely applied to inspect all kind of casting,NDT for air bubble,porosity and unwanted foreign.The equipment is applicable objects for NDT of cylinder welding defects and body,sidewall,lap,Crown steel cord and steel belt of tyre slag inclusion,crack,loosen and other flaws in hubs,pressure vessel,refractory material,bullet,boilr welded pipe and screwy pipe. Applications: Aerospace Automotive
