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IHDR-Algorithmus Verbesserte BGA- und PCBA-Röntgeninspektion UNICOMP AX8300 Ultraklare Fehlervisualisierung
IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the ...
110-KV-Hoch-Auflösungs-Röntgengerät Unicomp AX8300 für nicht zerstörende BGA-Lötgemeinschaftsanalyse
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips ...
System SMD-Kabel-X Ray, PWB-Inspektions-Ausrüstung AX8300 für Elektronik-Komponenten
SMD Cable Electronics Components Unicomp PCB X Ray Machine AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
Hochpräzise interne Fehlererkennung Lithiumbatterie-Sicherheitsinspektion Batterie-Röntgen AX9600 Unicomp New Energy Prüfgerät
High Accuracy Internal Defect Scan Lithium Battery Safety Inspection Battery X-ray AX9600 Unicomp New Energy Testing Instrument Product Positioning: AX9600 is Unicomp Technology's most sophisticated semiconductor X-ray inspection equipment. Its core value lies in being equipped with the self...
Hochpräziser BGA-QFN-Röntgendetektor AX8300 UNICOMP mit einer Mindestauflösung von 5 μm
High-Precision BGA QFN X-ray AX8300 UNICOMP 5μm Min Resolution Flat Panel Detector The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro...
Halbleiter BGA Flip Chip Inspektion Röntgen AX8300 UNICOMP Fingerabdruck-Zugangskontrolle
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Blasenverhältnismessung SMT Elektronische BGA-Komponenteninspektion Röntgen AX8300 UNICOMP
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
BGA Void Bridging Fehlende Kugelerkennung Röntgen AX8300 UNICOMP Echtzeit-Sicherheitsüberwachung
BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
110-kV-Röntgendetektor mit versiegeltem Rohr und 50°-Neigung AX8300 Unicomp Crimpverbindungs-Hohlrauminspektionsgerät
AX8300 110kV Sealed Tube X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly ...
