electronics x ray system
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Inline-Strahl SMTs SMD X Teilchipzähler Röntgenstrahl für Lagerinventar
Inline SMT SMD X ray Component Chip counter X-ray for warehouse inventory This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the
Chip-Zähler-Elektronik-Komponenten LX6000 Unicomp-Technologie-on-line-X Ray
Unicomp Technology Online Electronics Components Chip Counter LX6000 Features: • Fast speed and High ac curate Chip counting, reducing labor cost • No chip damage or lost with non-contact counting • Compatible of30-450mm tape reel • Auto matic link with ERP & Shop Floor System • Shielded cabinet protection to guarantee No leakage of X-ray • Counting Speed: 8S/ Reel • Inspection Accuracy: >99.8% • Min. Package: 0201 • One-button operation, automatic counting • Specially for
microfocus 130kV Röntgenstrahl von Unicomp AX9100 für lötende Inspektion SMTs PCBA BGA
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Unicomp-microfocus X Ray Machine für TWS-Lithium-Knopf-Zellqualitäts-Kontrolle
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
5μm Microfocus Röntgenstrahl mit FPD 55°, das Ansicht kippt, um lötende Lücke PCBA BGA QFN LED zu kontrollieren
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Microfocus Unicomp 130kV Röntgenstrahl AX9100 für Led PCBA leeres Maß lötend
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Nahe Rohr 2.5D Röntgenmaschine AX9100 für lötende Qualitätskontrolle LED mit hohen resolutin Bildern
Close tube 2.5D X-ray Machine AX9100 for LED soldering quality control with high resolutin images Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Ursprünglicher Hersteller der Röntgenmaschine für IC-Chip- und -komponentenfälschungsinspektion
Original Manufacturer of X-ray machine for IC chips and component counterfeit inspection Specifications of Xray machine AX7900: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Röntgenstrahlsystem microfocus 90KV 5um mit hoher Auflösung FPD für die lötende Lückenprüfung PCBA BGA
90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
