electronics x ray system
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X minimale Chipgröße 01005 des Ray-Chip-Zählers mit FPD-Verstärker u. Linie scn Kamera
X Ray Chip Counter Minimum chip size 01005 with FPD Intensifier & Line scn camera Model CX6000 Max.Voltage 100kV Max.Current 3mA Spot Size 0.4mm Working Method Stand alone Imaging system Line scan camera Scanning accuracy >99.8% Scanning size 440 X 60 mm Minimum material size 01005 Display 22'LCD Display Dimensions 17000 X 900 X 970 mm Weight 1000 kg Safety
Offline-Röntgenmaschine AX7900 Unicomp mit dem Selbst-Diagramm und BGA QFN LED leeres Selbstmaß lötend
Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat
Unicomp-Abschlussrohr AX7900 Röntgenstrahlsystem mit FPD, das Ansicht für Kabel- u. Drahtqualitätsinspektion SMTs EMS BGA IC kippt
Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
Automatisches Maß Unicomp AX9100 mit CNC-Programmierungsröntgenapparat für Aufschmelzlötenqualität PCBA BGA CSP QFN
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
Leistungsfähigkeit 2kW 100KV X Ray Flaw Inspection Machine High für LED-Beleuchtung
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Real-time image. ● 1000X system magnification. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
CER Computer-Motherboard-Chipset X Ray Inspection Machine AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Bildauflösung ICs hohe Unicomp-Schweißung X Ray Inspection Machine Microfocus
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
SMT BGA, das leere Maß-Röntgenmaschine Microfocus 130kV lötet
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
CNC, der X Ray Detector Automatic For PCBA BGA CSP QFN programmiert
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
