bga x ray inspection system
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Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Unicomp Röntgen-AX8300VS Multimode 3D Mikro-Fokus-Röntgen-Analyse-Inspektionssystem
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
Unicomp AX7900 90KV 2D-Röntgensystem für die genaue Erkennung von BGA-Leerstellen
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
Hochpräzisions-PTH-Durch-Loch-PCB-Montage Röntgenstrahl AX7900 Unicomp Hohe Stabilität
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
110-kV-Hochpräzisions-IC-Halbleiterkomponenten-Röntgengerät mit versiegelter Röhre AX8300MAX Unicomp-Qualitätskontrolle
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
Digitale Radiographie- und Röntgenmaschine Unicomp AX7900 zur Reparatur von Leiterplatten und zur Messung und Prüfung von IC/BGA-Kugelsolderungen
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kv Röntgenmaschine hochauflösende Unicomp AX7900 mit 5um-Rohr für BGA-Bindungsdrähte Kurvprüfung
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Automatische Void-Erkennung, hochpräzise BGA-Lötstellen-Röntgenausrüstung, AX8300 Unicomp-Qualitätskontrolle
Unicomp X-ray Detector AX8300 The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.Featuring a
Röntgenmaschine der hohen Auflösung AX8200MAX für innere Defektinspektion Semicon-Chips
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
