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x ray inspection system

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Qualität Des EMS-Halbleiter-BGA X Ray Leistungsaufnahme Inspektions-Maschinen-System-AX8200 0.8kW Fabrik

Des EMS-Halbleiter-BGA X Ray Leistungsaufnahme Inspektions-Maschinen-System-AX8200 0.8kW

EMS Semiconductor BGA X Ray Inspection Machine System AX8200 Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. ItemDefinitionSpecsSyst

Qualität Kontrollsystem FPD-Detektor Bga X Ray für Multifunktionsarbeitsplatz Fabrik

Kontrollsystem FPD-Detektor Bga X Ray für Multifunktionsarbeitsplatz

BGA X Ray Inspection Machine high-quality PCB inspection system X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Installation Unicomp will provide installation and calibration service at the customers

Qualität LED-Streifen on-line-Achsen-Verknüpfungs-System ADRs X Ray Inspection Equipment FPD 6 Fabrik

LED-Streifen on-line-Achsen-Verknüpfungs-System ADRs X Ray Inspection Equipment FPD 6

Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta

Qualität CER Computer-Motherboard-Chipset X Ray Inspection Machine AX9100 Fabrik

CER Computer-Motherboard-Chipset X Ray Inspection Machine AX9100

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Qualität Unicomp Microfocus X Ray Inspection System 130kV 3um für FPD-Bild Fabrik

Unicomp Microfocus X Ray Inspection System 130kV 3um für FPD-Bild

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Qualität BGA QFN Unicomp X Ray Inspection System 130KV mit der 6 Achsen-Bewegung Fabrik

BGA QFN Unicomp X Ray Inspection System 130KV mit der 6 Achsen-Bewegung

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualität Hohe Präzision X Ray Inspection Machine 1.6kW für Aluminiumcastings Fabrik

Hohe Präzision X Ray Inspection Machine 1.6kW für Aluminiumcastings

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Qualität Nahes Rohr 1.6kW X Ray Inspection Equipment CSP für medizinisches elektronisches Verbindungsstück Fabrik

Nahes Rohr 1.6kW X Ray Inspection Equipment CSP für medizinisches elektronisches Verbindungsstück

close tube x-ray inspection equipment in China high resolution image system for medical Electronic connector inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Qualität Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Löten Fabrik

Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Löten

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector