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Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100max
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
AX9100MAX X-ray Inspection Equipment High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components. System Overview This advanced X-ray inspection equipment performs precise nondestructive ...

Produktdetails

Hervorheben:

LED driver X-ray inspection equipment

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Solder joint damage detection X-ray machine

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AX9100max Unicomp X-ray inspection equipment

Machine Type: Elektronisches Halbleiter-Röntgeninspektionssystem
Model: AX9100max
X-Ray Tube Type: Versiegelter Typ
Voltage: 130kV
Pixel Size: 84 μm
Pixel: 1536*1536
Footprint: 1450 (B) × 1765 (T) × 1835 (H) mm
Produktbeschreibung
AX9100MAX X-ray Inspection Equipment High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components. System Overview This advanced X-ray inspection equipment performs precise nondestructive testing for semiconductor and industrial applications. Suitable for automotive electronics, new energy, photovoltaic, and high-density microelectronics manufacturing with comprehensive
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
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100%
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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