electronics x ray system
"
PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
In hohem Grade flexible Prüfungs-Ausrüstung X Ray für Elektronik und Halbleiter
Highly flexible and cost effective electronics and semiconductor X Ray Machine X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X-ray Inspecting Features: (1) Coverage of process defects up to 97%.
Maschine Unicomp Benchtop X Ray/Maschine der Elektronik-X Ray für Fehleranalyse-Labors
Benchtop Electronics X-ray Machine for failure analysis laboratories Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
110-KV-Hoch-Auflösungs-Röntgengerät Unicomp AX8300 für nicht zerstörende BGA-Lötgemeinschaftsanalyse
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free
Realzeit-Digital X Ray Machine For Electronics Inner Defekt-Inspektion AX7900
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Realzeitselbstofflinex Ray Machine For Electronics Inner Defekt-Inspektion AX7900
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
Unicomp 5μm Mikrofokus Hochpräzision PCBA IC Elektronik Röntgenmaschine AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Automatische CNC-Batch-Inspektion BGA Editmode Röntgen AX9100 UNICOMP Electronics PCBA-Verarbeitungsinspektionssystem
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function
Röntgenstrahl-Entdeckungs-Ausrüstungs-Elektronik SMTs BGA der hohen Leistung Halbleiter
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
