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Automatic NDT X-Ray inspection machine Unicomp AX9100MAX for connector voids inspection

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100MAX
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
The Unicomp AX9100MAX is an automatic NDT X-ray inspection machine engineered for high-precision connector voids inspection and advanced non-destructive testing. Featuring an off-line programming system and micro-focus 2D/2.5D imaging technology, it delivers reliable inspection of laptop battery ...

Produktdetails

Hervorheben:

Automatic NDT X-Ray machine

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Unicomp AX9100MAX connector inspection

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Electronics X-Ray void detection

Machine Type: Elektronisches Halbleiter-Röntgeninspektionssystem
Model: AX9100MAX
Footprint: 1450 (B) × 1765 (T) × 1835 (H) mm
Max.Power: 65W
X-Ray Tube Type: versiegelter Typ
Pixel Size: 84μm
Pixel: 1536*1536
System Magnification: 1600X
Produktbeschreibung
The Unicomp AX9100MAX is an automatic NDT X-ray inspection machine engineered for high-precision connector voids inspection and advanced non-destructive testing. Featuring an off-line programming system and micro-focus 2D/2.5D imaging technology, it delivers reliable inspection of laptop battery layer gaps and comprehensive battery module analysis. Applications The AX9100MAX supports a broad range of industrial and electronic inspection tasks, including: BGA, CSP, flip chips,
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