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electronics x ray system

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Qualität Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN Fabrik

Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...

Qualität 1.6kW Elektronik X Ray Machine 130kV AX9100 für lötende Lücke SMTs LED QFN Fabrik

1.6kW Elektronik X Ray Machine 130kV AX9100 für lötende Lücke SMTs LED QFN

130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, ...

Qualität Lineare Wiedergabe Unicomp AX8500 SMTs BGA Elektronik-X Ray Machine FPD 1000X Fabrik

Lineare Wiedergabe Unicomp AX8500 SMTs BGA Elektronik-X Ray Machine FPD 1000X

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000...

Qualität SCHLEIFEN-Inspektion AX9100 130kV Verpfändungselektronik-X Ray Machine For Semiconductor Wire Fabrik

SCHLEIFEN-Inspektion AX9100 130kV Verpfändungselektronik-X Ray Machine For Semiconductor Wire

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X...

Qualität CNC-Programmierbare automatische Inspektion Elektronik-Röntgengerät Unicomp AX7900 mit Neigungswinkel 60° für die Telefoninspektion Fabrik

CNC-Programmierbare automatische Inspektion Elektronik-Röntgengerät Unicomp AX7900 mit Neigungswinkel 60° für die Telefoninspektion

CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturin...

Qualität Maschine der Smt-Ausrüstungs-Elektronik-X Ray, PWB-Kontrollsystem Mikro-BGA auf Hieb-Analyse Fabrik

Maschine der Smt-Ausrüstungs-Elektronik-X Ray, PWB-Kontrollsystem Mikro-BGA auf Hieb-Analyse

PCB X Ray Machine high quality PCB inspection system Micro BGA on chop analysis Our unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much ...

Qualität Löten 0.8kW 5um FDA Elektronik-X Ray Machine For SMT BGA Fabrik

Löten 0.8kW 5um FDA Elektronik-X Ray Machine For SMT BGA

X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , ...

Qualität Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array Fabrik

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing ...

Qualität PCBA 22" Elektronik X Ray Machine zerstörungsfreier Prüfung LCD-1kW Fabrik

PCBA 22" Elektronik X Ray Machine zerstörungsfreier Prüfung LCD-1kW

Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • Multi-function DXI image processing system, CNC programmable detection • Max. loading area ...