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Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries
Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA Unicomp AX9100max X-ray Machine The AX9100max is a high-performance X-ray inspection system specially designed for IGBT inspection and other advanced ...
Unicomp AX9100max Röntgengerät 220AC 50Hz für Zinnklettern
Unicomp Ax9100max Röntgenmaschine zum Zinnklettern Die Unicomp AX9100MAX-Röntgenmaschine wurde speziell für Zinnkletteranwendungen entwickelt und bietet fortschrittliche Inspektionsfunktionen für verschiedene Branchen. Anwendungsfelder Weit verbreitet für: BGA, CSP, Flip -Chip LED, Sicherung, Diode ...
Unicomp AX9100max Röntgenmaschine 130kV 65W für BGA
Unicomp AX9100max Röntgengerät 130kV 65W FÜR BGA Die Unicomp AX9100max Röntgenmaschine ist für die IGBT-Inspektion konzipiert und wird in verschiedenen Branchen eingesetzt, darunter BGA, CSP, Flip Chip, LED, Sicherung, Diode, PCB, Halbleiter, Batterienindustrie,Gießerei für kleine Metalle, ...
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode ...
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode ...
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, ...
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing ...
AX8200max Unicomp Röntgensystem zur internen Fehlerinspektion elektronischer Komponenten
maintanence 90kV freie Bombenrohr SMT-Röntgenmaschine Unicomp AX8200MAX für lötendes Lückenmaß BGA LED Spezifikation der SMT-Röntgenmaschine Unicomp AX8200MAX System-Zusammenfassung Abdruck 1280 (W)×1500 (D)×1705 (H) Millimeter Maschinen-Gewicht 1400 Kilogramm Stromversorgung Wechselstrom 110~220V, ...
