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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100max
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 100set/montrh
Produktübersicht
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode ...

Produktdetails

Hervorheben:

Unicomp AX9100max X Ray Machine

,

Flip-Chip BGA X Ray Machine

,

FCBGA electronics inspection machine

Voltage: 130kV
Movement Control: Maus & Tastatur & Dual-Joystick
Max. Loading Area: Φ620[mm]
Max. Inspection Area: 450*600[mm]
Tilt And Rotation: Drehen Sie die Schwinge um bis zu 60°
Table: Ebenendrehung 360°
Produktbeschreibung
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
Fünf-Sterne
100%
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Alle Bewertungen
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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