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x ray scanning machine

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Qualität Entdeckungs-Maschinen-Scanner-keramischer Stein der Nahrung-80KV und des Getränkes X Ray kann Glas-Saft abfüllen Fabrik

Entdeckungs-Maschinen-Scanner-keramischer Stein der Nahrung-80KV und des Getränkes X Ray kann Glas-Saft abfüllen

Metal foreign Materials Ceramic Stone X Ray detection Machine Scanner Application: Food security: all kinds of meat, seafood, fruits and vegetables, additive, milk, chocolate and other foreigh matter inside the test. Foreigh body include: metal, glass, ceramic, stone, bone, plastic. Foreign body ...

Qualität Unicomp UNCT3200 Hochauflösendes 450-KV-3D-CT-System für die Porositätsanalyse von Triebwerksschaufeln Fabrik

Unicomp UNCT3200 Hochauflösendes 450-KV-3D-CT-System für die Porositätsanalyse von Triebwerksschaufeln

Unicomp UNCT3200 High-Resolution 450KV 3D CT System for engine blades Castings porosity analysis NDT Quality Inspection For Precision Turbine Blade Porosity Analysis Product Specifications Attribute Value Maximum tube voltage 450kV Focal size (EN 12543) d=0.4mm/d=1.0mm Maximum detected weight 100kg ...

Qualität Unicomp UNCT3200 Hochauflösendes 450KV 3D-CT/Computer-Tomographie-System für die Porositätsanalyse von Motorenblättern Fabrik

Unicomp UNCT3200 Hochauflösendes 450KV 3D-CT/Computer-Tomographie-System für die Porositätsanalyse von Motorenblättern

Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system ...

Qualität 110-kV-Hochpräzisions-IC-Halbleiterkomponenten-Röntgengerät mit versiegelter Röhre AX8300MAX Unicomp-Qualitätskontrolle Fabrik

110-kV-Hochpräzisions-IC-Halbleiterkomponenten-Röntgengerät mit versiegelter Röhre AX8300MAX Unicomp-Qualitätskontrolle

110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated ...

Qualität IC BGA CSP Verpackungsdefektinspektion Röntgen AX8300 UNICOMP Vollständiges automatisches CNC-Scannen Fabrik

IC BGA CSP Verpackungsdefektinspektion Röntgen AX8300 UNICOMP Vollständiges automatisches CNC-Scannen

IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

Qualität Tunnel CER SMTs BGA Inspektions-X Ray Chip Counter 440mm Fabrik

Tunnel CER SMTs BGA Inspektions-X Ray Chip Counter 440mm

Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage ...

Qualität X Ray SMD Chip Counter CX7000L 1.1kW mit Lager-Datenbank-Integration ERP MES Fabrik

X Ray SMD Chip Counter CX7000L 1.1kW mit Lager-Datenbank-Integration ERP MES

Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood ...

Qualität Automatischer Inline-Chip-Zähler Unicomp X Ray kein Schaden weniger Arbeitsoperation Fabrik

Automatischer Inline-Chip-Zähler Unicomp X Ray kein Schaden weniger Arbeitsoperation

Automatic Fast Speed High Accurate Inline Chip Counter X-Ray System With No Damage And Less Labor Operation Applications: Chip counting for SMT factroy, chip manufacturer Product Features: Fast speed and high accurate Chip counting,reducing labor cost One-button operation,Automatic counting . ...

Qualität Halbleiter-BGA-Flip-Chip-Inspektion Röntgen AX8300MAX UNICOMP 5 μm Mindestauflösung Fabrik

Halbleiter-BGA-Flip-Chip-Inspektion Röntgen AX8300MAX UNICOMP 5 μm Mindestauflösung

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...