x ray imaging system
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Unicomp UNCT3200 Hochauflösendes 450KV 3D-CT/Computer-Tomographie-System für die Porositätsanalyse von Motorenblättern
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
Röntgenmaschine der hohen Auflösung AX8200MAX für innere Defektinspektion Semicon-Chips
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Röntgenstrahl Chinas Unicomp 90KV mit Kontrollsystem HD PFD für die Chipset-Defekt-Entdeckung
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
Unicomp UNCT3200 320kV Industrie-CT-System für die Inspektion von Motorenblättern
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this
Neigungs-BGA-Lötstellen-Elektronik-Röntgeninspektionsgerät AX8300MAX Unicomp Automatische Void-Analyse
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Digitale Radiographie- und Röntgenmaschine Unicomp AX7900 zur Reparatur von Leiterplatten und zur Messung und Prüfung von IC/BGA-Kugelsolderungen
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kv Hochpräzisions-Röntgenmaschine Unicomp AX7900 für die PCBA-Qualitätskontrolle
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
5 Mikrometer hochauflösende 90kv-Röntgenmaschine Unicomp AX7900 mit fünf Mikrometer-Rohr für PCBA-Tests
5 micron high resolution 90kv X ray machine Unicomp AX7900 with five micron tube for PCBA testing Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming
90kv Röntgenmaschine hochauflösende Unicomp AX7900 mit 5um-Rohr für BGA-Bindungsdrähte Kurvprüfung
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
