x ray detector
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Automatische Inspektions-Inline-Maschine X Ray für 18650 Batterie LX-1Y60-110
Inline Automatic X Ray Inspection Machine for 18650 Battery LX-1Y60-110 Features: 1, Fully automated operations, reduce manpower, reduce production costs, improve production efficiency and quality consistency; 2, Software automatically determine, improve product consistency and quality assurance; 3, Comes with SPC software analysis, easy process control and quality data analysis; 4, The design fully consider the safety factors to ensure the safety of personal protection; 5,
Automatische Inspektions-Inline-Maschine LX-1Y130-110 Strahl der Energie-Bank-Batterie X
Inline Automatic Power Bank Battery X-ray Inspection Machine LX-1Y130-110 Features: 1, the magnification can be adjusted; 2, easy parameter setting, automatic judgment sorting bad product; 3, user-friendly software interface, easy to get started; 4, fully automated operations, reduce manpower, reduce production costs, improve production efficiency and quality consistency; 5, the software automatically determine, improve product consistency and quality assurance; Aftersales
Vollautomatische Nahrung Unicomp durch Maschine X Ray für Getränkefertigungsstraße
System Specifications: Model UNF - 1630 Best Inspection Ability 0.5mm(SUS304 ball) 0.3*2mm(SUS304 wire) 1.5 mm (Glass Ball) 1.5 mm(Ceramic Ball) X-ray tube MAX. 480W/120kV, 8mA Detector Pixel size 0.4mm Max Detecting Height 300mm Max Detecting Width 160mm Conveyor Parameter Speed 10-60m/min (Adjustable) Width 150mm Screen Full-color TFT 15" Touch Screen O/S Windows 7 Professional Connectivity LAN port, USB port Product Management Complete product log Parameter Adjustment Auto
Unicomp-Röntgensystem AX9100max zur Prüfung interner Defekte elektronischer Bauteile
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Röntgensystem AX9100max mit Algorithmen für die Bildrekonstruktion mit hoher Auflösung
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
CNC-programmierbare automatische Inspektion Elektronische Röntgenmaschine AX9100MAX mit Neigungswinkel von 60° zur Messung der IC-Krümmung
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT-PCB-Röntgenmaschine Mikronfokus-Punktgröße für BGA-Hohlräume Messung und Lötvorgang Kletterhöhe Inspektion
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
130-KV Mikron-Fokus-Spot-Größe Röntgengerät AX9100MAX mit Doppelcomputer für PCB&BGA-Inspektion
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
