pcb x ray inspection
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Elektronik Unicom-Röntgenmaschine für Defekt-Entdeckung auf Halbleiterwafer-Oberflächen
EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is
Tragbare Röntgenmaschine SMT-PWBs, Leistungsaufnahme des Metalldetektor-X Ray der Maschinen-0.5kW
Portable x-ray machine SMT PCB Metal X Ray Machine for Philippines Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Maschine Elektronik Benchtop X Ray für PWB/BGA-Zusammenhang und -analyse
BGA connectivity and analysis Benchtop X Ray Machine for PCB Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Unicomp 5um 90KV X Ray mit schiefer Ansicht FPD für Drahtanschluss-Kehrenkontrolle Semicon IC
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm
Inline-3D-CT-Maschine X Ray mit hoher Durchdringung für die PCB-Prüfung Unicomp LX9200
High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor
Dauerhaftes Kontrollsystem AX7900 X Ray Metallfür PCBA SMT LED setzt sich Entdeckung ab
Metal Xray machine AX7900 for PCBA SMT LED defects detection Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage
Hochpräzises UNICOMP-Röntgen-CT-Gerät AX9500 für eine genaue PCB-/BGA-Inspektion
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
Unicomp LX9200 3D-CT-Röntgen-Computertomographiegerät 130 kV Inline für die PCB-BGA-Inspektion
Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...
Röntgenstrahlsystem zerstörungsfreier Prüfung der hohen Auflösung für werfende Teil-Qualitäts-Automobilinspektion
High Resolution NDT X-ray system for Automotive casting Parts Quality Inspection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm Resolution 3.0LP/mm
