electronic inspection equipment
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Wechselstroms 110~220V Bga Detektor der Inspektions-Ausrüstungs-hallo Entschließungs-FPD für SMT industriell
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Kondensator-interne Defekte X Ray Inspection Equipment Micro Focus elektronisch
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features Fingerprint Access Management System Real-time Monitoring of Radiation 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for
Ems-SMT Lücke zerstörungsfreier Prüfung PWB-Elektronik-X Ray Machine BGA QFN LED lötende Inspektions-Ausrüstung
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic
Maschinen-vielseitiges System Wechselstroms 110-220V Elektronik-X Ray für Halbleiterchip, PFEILER
Electronics X Ray Machine for BGA , CSP , LED , Flip Chip , Semiconductor OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you. 6
90 kV 5 μm Auflösung Bindungsdraht Halbleiter Röntgen Tester CX3000 Unicomp Gold Bond Inspektionsgerät
CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, and other specialized industries. Key Features Super Compact Desktop Design Multi-function X-Ray Inspection Multiple Inspection Modes Portable with Wheels Status
CX3000 Entdeckungs-Maschine der Elektronik-PCBA Unicomp X Ray, Maschine Benchtop X Ray
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto
Detektor AX8300 Hochleistung Unicomp X Ray für SMD-Kabel-Elektronik-Komponenten
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much. Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification
Inspektions-Maschinen-Elektronik BGA AX8200 EMS-Halbleiter Unicomp X Ray
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
AX7900 IC LED befestigt Röntgenprüfungs-Maschine, Maschine Digitalelektronik-X Ray
AX7900 IC LED Clips X-ray Inspection Machine Electronic Components Detector Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max.
