bga x ray inspection system
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Chipset-Führungsrahmen innere Qualitäts-Inspektion durch Bombenrohr AX7900 X Ray Machine Unicomp 5um
Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
Defekte FDAs 90KV Bombenrohr-X Ray Detection Equipment For Resistance
FDP 90KV X-Ray Machine For Resistance Defects DetectingApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Elektronik X Ray Machine 5um AX8500 des Halbleiter-110kV für PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Abschluss-Rohr X Ray Microfocus 130KV PWB-Inspektions-Maschine für SMT BGA CSP LED PCBA
Microfocus 130KV close tube X-ray inspection machine for SMT BGA, CSP, LED, PCBA soldering quality inspection Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: ● SMT, BGA, CSP, Flip
SMT IC-Röntgengerät mit 5 Mikronen-Fokusspunkt Unicomp AX7900
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi
Kabinett Unicomp-Röntgenapparat 220AC/50Hz mit DXI-Bildverarbeitungs-System
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Industrielle Darstellungs-System-Quelle 80kV/90kV X Ray mit Submikron-Brennfleck-Größe
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
Röntgenstrahl Unicomp AX8500 110kV 5um 2.5D für lötende Qualitätskontrolle Elektronik SMTs PCBA BGA IC
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Halbleiter-hohe Auflösung, die X Ray Machine 90KV 5um schweißt
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
