bga inspection equipment
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Große Inspektion inszeniert Maschine PWBs X Ray, Röntgenstrahl-Inspektions-Ausrüstungs-Super Sensitive
Large inspection stages PCB X Ray Machine with high quality X-ray images Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Item Definition Specs ...
Tunnel CER SMTs BGA Inspektions-X Ray Chip Counter 440mm
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage ...
Lichter 130kV 5μm X Ray Inspection Equipment For 1.2m LED
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic ...
110-kV-Röntgendetektor mit versiegeltem Rohr und 50°-Neigung AX8300 Unicomp Crimpverbindungs-Hohlrauminspektionsgerät
AX8300 110kV Sealed Tube X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly ...
Hochgeschwindigkeits-LED-Streifen on-line-Detektor 130kv ADRs X Ray Inspection Equipment FPD
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W ...
Maschinen-System der EMS-Halbleiter-Elektronik-X Ray für BGA- und CSP-Inspektion
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...
Detektor 130KV SMTs BGA X Ray Detection Equipment Flip Chip FPD für Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Ausrüstung 22" BGA-Inspektions-X Ray LCD mit programmierbarer Untersuchungsfunktion CNC
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC ...
PWBs BGA Maschinen-Golfball der Inspektions-Elektronik-X Ray innerhalb der Qualitäts-Prüfung
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
