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Maschine der Elektronik-X Ray

Qualität Elektronik X Ray Machine 5um AX8500 des Halbleiter-110kV für PCBA BGA Fabrik

Elektronik X Ray Machine 5um AX8500 des Halbleiter-110kV für PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Qualität Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN Fabrik

Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Qualität 5um SMT X Ray Equipment CNC programmierbar für Lücken EMS BGA Fabrik

5um SMT X Ray Equipment CNC programmierbar für Lücken EMS BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Qualität Elektronik X Ray Machine 1.0kW des Algorithmus-FPD für LED-Rückflut-Lötmittel Fabrik

Elektronik X Ray Machine 1.0kW des Algorithmus-FPD für LED-Rückflut-Lötmittel

Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Qualität Knall-Paket Kilowatts X Ray Machine For SMT BGA QFP CNC programmierbares 1,0 Fabrik

Knall-Paket Kilowatts X Ray Machine For SMT BGA QFP CNC programmierbares 1,0

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Qualität Eingekapselte Spotgröße der Komponenten-Widerstand-Elektronik-X Ray Machine 5μm Fabrik

Eingekapselte Spotgröße der Komponenten-Widerstand-Elektronik-X Ray Machine 5μm

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Qualität Strahlnmaschine Unicomp AX8500 2.5D 110kv X für Semicon-leadframe Qualität, die mit Selbstmaß überprüft Fabrik

Strahlnmaschine Unicomp AX8500 2.5D 110kv X für Semicon-leadframe Qualität, die mit Selbstmaß überprüft

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Qualität 5μm Microfocus Röntgenstrahl mit FPD 55°, das Ansicht kippt, um lötende Lücke PCBA BGA QFN LED zu kontrollieren Fabrik

5μm Microfocus Röntgenstrahl mit FPD 55°, das Ansicht kippt, um lötende Lücke PCBA BGA QFN LED zu kontrollieren

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Qualität Röntgenstrahl Unicomp AX8500 110kV 5um 2.5D für lötende Qualitätskontrolle Elektronik SMTs PCBA BGA IC Fabrik

Röntgenstrahl Unicomp AX8500 110kV 5um 2.5D für lötende Qualitätskontrolle Elektronik SMTs PCBA BGA IC

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)