Maschine der Elektronik-X Ray
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & ...
Rotationserkennung Präzise geometrische Vergrößerung Chipproduktion Röntgen UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time ...
PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive ...
CNC-programmierbare automatische Inspektion. Elektronik-Röntgengerät Unicomp AX9100MAX für die IC-Krümmungsmessung
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. ...
SMT-PCB-Röntgengerät mit hochauflösender Mikrometer-Fokusfleckgröße Unicomp AX9100MAX für die BGA-Hohlraummessung
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer ...
130-KV Mikron-Fokus-Punktgröße Röntgengerät Unicomp AX9100MAX mit Doppelcomputer für PCB-BGA-Inspektion
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature ...
Hochwertige elektronische Platinen 2D-2,5D-Röntgengerät Unicomp AX9100MAX mit 360-Grad-Drehtisch
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides ...
Unicomp AX8300 Röntgengerät zur Qualitätskontrolle, automatische Hohlraumerkennung, hohe Bewegungspräzision, BGA
Unicomp AX8300 X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it provides balanced ...
Hochpräzises BGA-Lötverbindungs-Röntgenqualitätskontrollsystem AX8300 Unicomp-Ausrüstung
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
