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Qualität Maschine Unicomp 110 LP/CM der 15μm Spotgröße-Lithium-Batterie-X Ray Entschließung Fabrik

Maschine Unicomp 110 LP/CM der 15μm Spotgröße-Lithium-Batterie-X Ray Entschließung

Unicomp Lithium Battery Online X-Ray Inspection System, Compatible with Battery Production Line Specifications: System Parameters Dimension(L×W×H) 3300mmX1500mmX2000mm Weight 2.5t Working Environment 0~40℃ Power 4KW Accuracy ±60μm Operating Mode In-line X-ray Tube Type Closed Max.Voltage 110kv Max.Current 0.45mA Focal Spot Size 15um Image Detector Type Image Intensifier Resolution 110 Lp/cm Size 4” Applied to 18650 Cylindrical Battery Max.Capacity 60ppm/130ppm Operation Ratio

Qualität Unicomp UNCT3200 320kV Industrie-CT-System für die Inspektion von Motorenblättern Fabrik

Unicomp UNCT3200 320kV Industrie-CT-System für die Inspektion von Motorenblättern

Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this

Qualität Inline-Kontrollsystem-effektive Realzeit der Ernte-zerstörungsfreie Prüfungs-X Ray für Fremdmaterialien Fabrik

Inline-Kontrollsystem-effektive Realzeit der Ernte-zerstörungsfreie Prüfungs-X Ray für Fremdmaterialien

Inline Crop NDT X Ray System , Effective Foreign Materials Real-time Detector Product Feature Flexibility Tooling and Fixture Easy to Operate, User-friendly Software Design Customized to Provide Solutions After-sales Service of Entire Network Low Cost of Testing Service Inspection Image:

Qualität Röntgenmaschine der hohen Auflösung AX8200MAX für innere Defektinspektion Semicon-Chips Fabrik

Röntgenmaschine der hohen Auflösung AX8200MAX für innere Defektinspektion Semicon-Chips

High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic

Qualität Röntgenstrahl Chinas Unicomp 90KV mit Kontrollsystem HD PFD für die Chipset-Defekt-Entdeckung Fabrik

Röntgenstrahl Chinas Unicomp 90KV mit Kontrollsystem HD PFD für die Chipset-Defekt-Entdeckung

China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming

Qualität Dauerhafter Chip-Zähler X Ray, Maschinen-Komponente der Elektronik-X Ray, die Ems-Inventar-Industrie 4,0 zählt Fabrik

Dauerhafter Chip-Zähler X Ray, Maschinen-Komponente der Elektronik-X Ray, die Ems-Inventar-Industrie 4,0 zählt

SMD Chip Electronic Component Unicomp X ray Counter Inspection System This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classifica

Qualität Gegen-BGA X Ray Inspektions-Maschine Mikro-BGA des Chip-auf Hieb-Analyse Fabrik

Gegen-BGA X Ray Inspektions-Maschine Mikro-BGA des Chip-auf Hieb-Analyse

Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis​ X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to

Qualität Unicomp Röntgen AX8300 Plus Halbleiter Mikrofokus-Röntgenprüfgerät Fabrik

Unicomp Röntgen AX8300 Plus Halbleiter Mikrofokus-Röntgenprüfgerät

Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel

Qualität 110-kV-Inline-Röntgengerät Fabrik

110-kV-Inline-Röntgengerät

Unicomp 110kV 30ppm & 60ppm Inline Xray machine for lithium cell automatically inspection with NG part auto-sorting Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø Onsite installation, debugging and training services Ø Scheduled call & visits Ø Life-long free software upgrading Prodcution Capacity Ø Wuxi Factory: 6000M2 Ø Shenzhen Factory: 9000M2 Ø Chongqing Factory:8500M2 Ø Current Capacity: 300 Sets /Month Ø Expansion Capacity: 1000