x ray detector
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C formen installierten Ausrüstungs-Stand Arm-den industriellen X Ray allein, Gewicht 18.65T
C Shape Arm Industrial X Ray Inspection Systems Stand Alone Installed in Vietnam Features: Highest image quality for reliable inspection decisions Economic solution for small batch sizes and sample tests Excellent results with minimum investment due to ease-of-use software interface Small footprint fits into existing plant layouts Quick release rotation axis for mounting tires for 360° inspection Worldwide service network with services tailored to your individual needs
Nahrungsmittelfischgräte-Süßigkeits-Nuss-Fremdmaterial-Röntgenstrahl-Metalldetektor
Flexible Online Industrial X Ray Machine for Meat Can Vegetable Used in Colombia Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and
160 kV hocheffiziente digitale Radiographie-Röntgeninspektionsausrüstung für Metall, Kunststoff, Keramik UNC160 Unicomp
160kV High Efficiency Digital Radiography X-ray Inspection Equipment for Metal Plastic Ceramic UNC160 Unicomp Detection purpose: Metal castings, hardware products, plasticproducts, refractory materials, review materials, ceramic body and metalparts welding and other products for non-destructive. System Parameters Dimensions 2024mm*2160mm*2292mm(L*W*H) Equipment weight 3.2T Power Consumption 6KW Power Supply 380AC/50Hz X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube
PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
IC-Kurvmessung Unicomp AX9100MAX Röntgenmaschine mit 84μm Pixelgröße und 60° Neigungswinkel
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT-PCB-Röntgenmaschine Unicomp AX9100MAX hochauflösende Mikronenfokus-Punktgröße für BGA-Leere und Lötpasteinspektion
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130-KV Mikron-Fokus-Punktgröße Röntgengerät Unicomp AX9100 Modernisiertes Modell AX9100MAX mit Dual-Computern für PCB&BGA-Inspektion
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Hochspezifische elektronische Platten 2D & 2.5D Röntgenmaschine Unicomp AX9100MAX mit 360-Grad-Rotationstisch für BGA und PCB-Inspektion
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Erfassungssystem 3.5kW LED Inline-X Ray Machine ADR Stangen-für innere Qualitäts-Inspektion
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
