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Qualität CSP LED 110kV X Ray Scanner 5um für Löten das LED-Streifen-PCBA Fabrik

CSP LED 110kV X Ray Scanner 5um für Löten das LED-Streifen-PCBA

110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size

Qualität Bombenrohr AX8500 CSP BGA X Ray Scanner Machine 100KV FPD Microfocus Fabrik

Bombenrohr AX8500 CSP BGA X Ray Scanner Machine 100KV FPD Microfocus

High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD

Qualität Elektronik X Ray Machine 5um AX8500 des Halbleiter-110kV für PCBA BGA Fabrik

Elektronik X Ray Machine 5um AX8500 des Halbleiter-110kV für PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualität Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Löten Fabrik

Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Löten

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualität 5um SMT X Ray Equipment CNC programmierbar für Lücken EMS BGA Fabrik

5um SMT X Ray Equipment CNC programmierbar für Lücken EMS BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualität Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN Fabrik

Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Qualität Chip AX8500 CSP LED X Ray Machine Closed Tube Flip für Halbleiter 100KV Fabrik

Chip AX8500 CSP LED X Ray Machine Closed Tube Flip für Halbleiter 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualität Lineare Wiedergabe Unicomp AX8500 SMTs BGA Elektronik-X Ray Machine FPD 1000X Fabrik

Lineare Wiedergabe Unicomp AX8500 SMTs BGA Elektronik-X Ray Machine FPD 1000X

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Qualität Inline-3D-CT-Maschine X Ray mit hoher Durchdringung für die PCB-Prüfung Unicomp LX9200 Fabrik

Inline-3D-CT-Maschine X Ray mit hoher Durchdringung für die PCB-Prüfung Unicomp LX9200

High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor