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Qualität SMT BGA, das leere Maß-Röntgenmaschine Microfocus 130kV lötet Fabrik

SMT BGA, das leere Maß-Röntgenmaschine Microfocus 130kV lötet

130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement​ Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One

Qualität Rotations-Tabelle AX9100 130kV Microfocus der Elektronik-X Ray Machine With FPD schiefe Ansicht-360 Fabrik

Rotations-Tabelle AX9100 130kV Microfocus der Elektronik-X Ray Machine With FPD schiefe Ansicht-360

AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of ​Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of ​Unicomp AX9100: ● SMT, BGA, CSP, Flip

Qualität schiefe Ansicht des Abschluss-5um des Rohr-AX9100 Unicomp X Ray Machine FPD für Inspektion ICs Semicon Fabrik

schiefe Ansicht des Abschluss-5um des Rohr-AX9100 Unicomp X Ray Machine FPD für Inspektion ICs Semicon

Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualität SCHLEIFEN-Inspektion AX9100 130kV Verpfändungselektronik-X Ray Machine For Semiconductor Wire Fabrik

SCHLEIFEN-Inspektion AX9100 130kV Verpfändungselektronik-X Ray Machine For Semiconductor Wire

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualität Abschluss-Rohr AX9100 Unicomp X Ray Machine 130kV für PCBA BGA QFN leere Kontrolle lötend Fabrik

Abschluss-Rohr AX9100 Unicomp X Ray Machine 130kV für PCBA BGA QFN leere Kontrolle lötend

130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualität Unicomp AX9180 180kV Mikrofokus-Elektronen-Röntgenmaschine mit FPD schräg Fabrik

Unicomp AX9180 180kV Mikrofokus-Elektronen-Röntgenmaschine mit FPD schräg

Unicomp AX9180: 180-kV-Mikrofokus-Röntgengerät mit 10 μm Punktgröße, 60° Neigung und 7-Achsen-Verbindung. Das hochauflösende FPD bietet eine 1000-fache Vergrößerung für eine präzise PCB-, BGA- und Halbleiterinspektion. Inklusive 1 Jahr Garantie und Offline-Programmierung.

Qualität PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten Fabrik

PCB-Röntgenmaschine mit hoher Vergrößerung Unicomp AX9100MAX für Elektronik-IC-Komponenten

High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery

Qualität Niedrige Zusammenbruch 225KV Inspektion zerstörungsfreier Prüfung X Ray Machine Automotive Aircraft Vessel Fabrik

Niedrige Zusammenbruch 225KV Inspektion zerstörungsfreier Prüfung X Ray Machine Automotive Aircraft Vessel

Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up

Qualität Maschine PWBs X Ray der hohen Auflösung Fabrik

Maschine PWBs X Ray der hohen Auflösung

Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight