industrial inspection systems
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Bombenrohr AX8500 CSP BGA X Ray Scanner Machine 100KV FPD Microfocus
High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD
Elektronik X Ray Machine 110kV Unicomp AX8500 CSP SMT für SMT PCBA BGA QFN
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Lineare Wiedergabe Unicomp AX8500 SMTs BGA Elektronik-X Ray Machine FPD 1000X
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
Unicomp AX9180 180kV Mikrofokus-Elektronen-Röntgenmaschine mit FPD schräg
Unicomp AX9180: 180-kV-Mikrofokus-Röntgengerät mit 10 μm Punktgröße, 60° Neigung und 7-Achsen-Verbindung. Das hochauflösende FPD bietet eine 1000-fache Vergrößerung für eine präzise PCB-, BGA- und Halbleiterinspektion. Inklusive 1 Jahr Garantie und Offline-Programmierung.
Waschen Sie Maschine Schrumpfung SMTs/EMS X Ray Unicomp-Technologie für Getriebe-Abschnitt ab
Gearbox Section Sponge Shrinkage Metal X Ray Detection Machine in Malaysia Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify casting integrity. Casting defects such as cavities, gas, inclusion, tearing, foreign material, porosity, shrinkage and sponge are found quickly and objectively using x-ray inspection.
Hohe Bewegungspräzision 90kV versiegelte Röhre MOSFET-Halbleiterkomponente Röntgengerät AX7900 Unicomp Qualitätskontrolle
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Gefälschte Elektronik 0.8kW X Ray Scanner AC110V für Dioden-Induktor
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Knall-Paket Kilowatts X Ray Machine For SMT BGA QFP CNC programmierbares 1,0
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Hochpräziser LED-Röntgenprüfer AX9600 Unicomp für die Herstellung von Optoelektronik
High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester The UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components.
