industrial inspection systems
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Unicomp UNX6030N Schwerlast-Röntgenstrahl-Lebensmittelinspektionsmaschine für Sojamilchpulver in IP66-Wasserdichtheit
Unicomp UNX6030N heavy load X ray food inspection machine for soybean milk powder in IP66 waterproof level APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES Easy to Operate: one button start&stop,
Hochspezifische elektronische Platten 2D & 2.5D Röntgenmaschine Unicomp AX9100MAX mit 360-Grad-Rotationstisch für BGA und PCB-Inspektion
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Parts Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard,
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware
Unicomp UNC160 NDT X-Ray Inspection Equipment For Automotive Hardware Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to international
Unicomp UNC160 NDT X-Ray Inspection Equipment For Vehicle Parts
Unicomp UNC160 NDT X-Ray Inspection Equipment For Vehicle Parts Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to
Unicomp UNC160 NDT-Röntgenprüfgeräte für Fahrzeugkomponenten
Unicomp UNC160 NDT X-Ray Inspection Equipment For Car Components Product Description Unicomp UNC160 X-Ray for detecting internal defects in brake pads. Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features Broad Application Scope: Supports large-scale inspections with high load-bearing capacity. Safety Compliance: Adheres to
Maschinen-System der EMS-Halbleiter-Elektronik-X Ray für BGA- und CSP-Inspektion
EMS Semiconductor Electronics X Ray Machine System for BGA and CSP inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Motherboard Bga-Röntgenprüfungs-System mit großem Inspektions-Extrabereich
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Auslandsangelegenheits-Analyse nach Schuhen, Auslandsangelegenheits-Kontrollsystem der Fußbekleidungs-X Ray
Foreign Matter Analysis by shoes , footwear X-ray Foreign Matter Inspection System Features: Excellent operability: Automatically save product images, convenient for later analysis. Adapt to multiple product inspection: Pallets, bags, boxes, bottles, cans, loose products etc. High specification hardware configuration: The components of the equipment are imported brands to ensure the performance and service life of the whole machine. Easy to disassemble and clean: Easier
