electronics x ray system
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360° Rotation CNC Automatische MOSFET-Leiterplattenbestückung Röntgeninspektionssystem AX8300MAX Unicomp Stabile Leistung
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
Automatische Void-Erkennung, hochpräzise BGA-Lötstellen-Röntgenausrüstung, AX8300 Unicomp-Qualitätskontrolle
Unicomp X-ray Detector AX8300 The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.Featuring a
Unicomp CX7000L Chip Counter Selbstentwickelte Software mit Anti-Interferenz-Zählalgorithmus
Unicomp Self-developed Software with Anti-interference Counting Algorithm CX7000L Chip Counter Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80 kV Max. Current 700
5 μm Focus Spot PCBA-plattiertes Durchgangsloch-Röntgeninspektionsgerät AX8300 Unicomp PTH Void Defect Detector
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV
50°-Neigungserkennungs-Kabelbaum-Kabel-Röntgeninspektionsgerät AX8300 Unicomp Crimpverbindungs-Lückendetektor
50°Tilt Detection Wire Harness Cable Xray Inspection Machine AX8300 Unicomp Crimp Joint Void Detector The AX8300 is a dedicated X-ray inspection system engineered for high-precision PCBA production. Equipped with a proprietary 110kV micro-focus X-ray tube, it fills the performance void between conventional 90kV and 130kV equipment, delivering balanced penetration ideal for applications where 90kV lacks penetration and 130kV provides excessive energy. Integrated with advanced
Unicomp UNCT2600 hochauflösendes 225KV 3D-CT-System für NDT-Präzisions-Computertomographie für die Porositätskontrollen von Gießen
Unicomp UNCT2600 High-Resolution 225KV 3D CT System For NDT Precision Computed Tomography For Castings Porosity Inspection Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core,
Unicomp UNCT2600 Industrielle 225KV 3D Computertomographie-System NDT Qualitätsprüfung für Präzisionsguss Porositätsanalyse
Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection for Precision Castings porosity Analysis Product Description: The UNCT2600 is an exceptionally advanced and compact industrial computed tomography (CT) inspection system. It is adaptable for use with materials of various sizes, catering to the high - precision inspection requirements of diverse industries. This system is primarily employed for inspecting small metal castings, non - ferrous
160-KV-CT-Maschine Unicomp UNCT3100 für Zylinder / Metallguss / Luftfahrtteile 3D-nicht-zerstörerisches Testen
160KV CT machine Unicomp UNCT3100 for cylinder,metal castings, aerospace parts 3D non-destructive testing Product Description: The UNCT3100 stands as a compact yet powerful industrial CT inspection system, renowned for its high precision capabilities. It is a versatile tool, adaptable to diverse industries' unique inspection needs. Primarily utilized for meticulous examination of small metal castings, non-ferrous metals, lithium battery cells, intricate chips, electronic
