bga x ray inspection system
"
Hochpräzise 2,5D/3D-Röntgeninspektion zur BGA- und PCBA-Defekterkennung UNICOMP AX8300
High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In ...
Inspektions-Maschine der elektronischen Bauelement-BGA X Ray
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more ...
Halbleiter BGA Flip Chip Inspektion Röntgen AX8300 UNICOMP Fingerabdruck-Zugangskontrolle
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Motherboard Bga-Röntgenprüfungs-System mit großem Inspektions-Extrabereich
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, ...
Eigenständiges, leeres BGA-Röntgeninspektionsgerät, DXI-Bildverarbeitungssystem, 65 W
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and ...
Halbleiter-BGA-Flip-Chip-Inspektion Röntgen AX8300MAX UNICOMP 5 μm Mindestauflösung
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...
PCBA, das Inspektions-Maschinen-hohe Geschwindigkeit BGA X Ray mit großer Beispieltabelle lötet
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...
Kontrollsystem Halbleiter SMTs Bga X Ray für interne Defekt-Entdeckung
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
100kV PCBA X Ray Inspection System Unicomp Electronics für BGA Lücke/Löten
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
