automatic x ray machine
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Röntgenkontrollsystem für Fremdstoffe im Tee mit Mensch-Maschine-Schnittstelle
X-Ray Inspection System For Foreign Materials In Tea Technical Parameters: Product Name: X-Ray Inspection System For Foreign Materials In Tea Dimensions: 2530mm*1085mm*2075mm(L*W*H) Machine Weight: 600kg Radiation safety ≦1μSv/h Maximum load-bearing 10KG Form of the inspected item Pouch packaging Training: Yes, we warmly welcome you to visit our factory, we will arrange the free training for you. Services: Help customers analyze product projects and provide detection
100kV PCBA X Ray Inspection System Unicomp Electronics für BGA Lücke/Löten
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
Wechselstroms 110~220V Bga Detektor der Inspektions-Ausrüstungs-hallo Entschließungs-FPD für SMT industriell
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Ausrüstung 22" BGA-Inspektions-X Ray LCD mit programmierbarer Untersuchungsfunktion CNC
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
Wirksame Erkennungsfläche 129x129mm Röntgenuntersuchungsgerät für elektrisches Rasiermesser 1280x1220x1615mm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
600X Systemvergrößerung Röntgenprüfgerät für elektrisches Rasiermesser mit 85 μm Pixelgröße
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, and more. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC Programming
5 μm Schwerpunktpunktgröße Röntgenprüfgerät für PCBA 1100 kg Kapazität
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC
Upgrade auf Flat Panel Detector FPD Röntgenuntersuchungsgerät für IC mit 1536*1536mm Pixel Matrix
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC
Unicomp-Röntgenstrahl-industrielle Kontrollsysteme
Industrial X Ray Machine Unicomp UNC160S For Metal Plastic Casting With UNC160S, Unicomp X-ray inspection of wheels is carried out efficiently for spot-check sample tests or small batch sizes. This system is ideally suited for inspections near the casting machines or in R&D. Best-in-class scalabe X-ray inspection systems for assembly and laboratory applications.With optimitzed software and hardware, these systems produce higher quality and more consistent results than other
