Maschine der Elektronik-X Ray
22" Defekt-elektronische Inspektions-Ausrüstungs-hohe Auflösung LCD-Monitor SMTs EMS lötende
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
1.6kW Offline- Programmierungs-Unicomp X Ray AX9100 für Verbindungsstück
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D ...
Verstärker 130kV 3um Microfocus X Ray FPD für Aluminium-PCBA Löten
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D ...
Hohe Präzision X Ray Inspection Machine 1.6kW für Aluminiumcastings
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D ...
Heizung FPD 130kV X Ray Inspection Machine For Cartridge
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X ...
PWBs BGA Maschinen-Golfball der Inspektions-Elektronik-X Ray innerhalb der Qualitäts-Prüfung
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area ...
Multifunktionsmaschinen-Hochgeschwindigkeitsrealzeit der elektronik-X Ray für Goldkugel
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and ...
CNC programmierbarer Maschinen-Golfball-innere Qualitäts-Inspektion der Entdeckungs-Elektronik-X Ray
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...
Hohes System der linearen Wiedergabe der Elektronik-X Ray für Lücken-Inspektion BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area ...
