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Maschine der Elektronik-X Ray

Qualität Unicomp AX9100max Röntgenmaschine 130kV 65W für BGA Fabrik

Unicomp AX9100max Röntgenmaschine 130kV 65W für BGA

Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, ...
Qualität Unicomp AX9100max Röntgenmaschine für zylindrische Zellen Fabrik

Unicomp AX9100max Röntgenmaschine für zylindrische Zellen

Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image ...
Qualität Unicomp AX9100max Röntgenmaschine 130kV 65W für IGBT-Inspektion Fabrik

Unicomp AX9100max Röntgenmaschine 130kV 65W für IGBT-Inspektion

Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and ...
Qualität Unicomp AX9100max Röntgengerät 220AC 50Hz für Zinnklettern Fabrik

Unicomp AX9100max Röntgengerät 220AC 50Hz für Zinnklettern

Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconducto...
Qualität Unicomp AX9100max Röntgenmaschine 2400kg für MOS-Röhren-Inspektion Fabrik

Unicomp AX9100max Röntgenmaschine 2400kg für MOS-Röhren-Inspektion

Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection ...
Qualität Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem Fabrik

Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem

Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny ...
Qualität Maschinen-hohen Leistung X Ray PWBs SMT BGA LED der Elektronik-X Ray Quellen 100KV Fabrik

Maschinen-hohen Leistung X Ray PWBs SMT BGA LED der Elektronik-X Ray Quellen 100KV

PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon ...
Qualität Hochspezifische elektronische Platten 2D & 2.5D Röntgenmaschine Unicomp AX9100MAX mit 360-Grad-Rotationstisch für BGA und PCB-Inspektion Fabrik

Hochspezifische elektronische Platten 2D & 2.5D Röntgenmaschine Unicomp AX9100MAX mit 360-Grad-Rotationstisch für BGA und PCB-Inspektion

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature ...
Qualität SMT-PCB-Röntgenmaschine Unicomp AX9100MAX hochauflösende Mikronenfokus-Punktgröße für BGA-Leere und Lötpasteinspektion Fabrik

SMT-PCB-Röntgenmaschine Unicomp AX9100MAX hochauflösende Mikronenfokus-Punktgröße für BGA-Leere und Lötpasteinspektion

It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary ...