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SMT industrial equipment BGA inspection x-ray machine Unicomp AX9100MAX for PCB assembly quality control

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100MAX
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
The Unicomp AX9100MAX is an SMT industrial X-ray inspection machine engineered for high-precision, non-destructive testing of semiconductors and electronic assemblies. Built for PCB assembly quality control and motherboard testing, it delivers comprehensive inspection of BGA, CSP, and microelectroni...

Produktdetails

Hervorheben:

BGA inspection X-ray machine

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PCB assembly quality control X-ray

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Unicomp AX9100MAX X-ray equipment

Machine Type: Elektronisches Halbleiter-Röntgeninspektionssystem
Model: AX9100MAX
Footprint: 1450 (B) × 1765 (T) × 1835 (H) mm
Max.Power: 65W
X-Ray Tube Type: versiegelter Typ
Pixel Size: 84μm
Pixel: 1536*1536
System Magnification: 1600X
Produktbeschreibung
The Unicomp AX9100MAX is an SMT industrial X-ray inspection machine engineered for high-precision, non-destructive testing of semiconductors and electronic assemblies. Built for PCB assembly quality control and motherboard testing, it delivers comprehensive inspection of BGA, CSP, and microelectronic components using micro-focus 2D/2.5D imaging technology, including IC curvature measurement. Applications BGA, CSP, and flip chip inspection LED packages, fuses, and power diodes
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