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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100max
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

Produktdetails

Hervorheben:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: Elektronisches Halbleiter-Röntgeninspektionssystem
Model: AX9100max
X-Ray Tube Type: Versiegelter Typ
Pixel Size: 84 μm
Pixel: 1536*1536
Footprint: 1450 (B) × 1765 (T) × 1835 (H) mm
Produktbeschreibung
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
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100%
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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