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AI Super‑Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX9100max
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: L/C, T/T
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
AI Super-Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision ...

Produktdetails

Hervorheben:

AI Super-Resolution X-ray machine

,

CE FDA certified defect detector

,

SMT solder void detector

Machine Type: Elektronisches Halbleiter-Röntgeninspektionssystem
Model: AX9100max
X-Ray Tube Type: Versiegelter Typ
Pixel Size: 84 μm
Pixel: 1536*1536
Footprint: 1450 (B) × 1765 (T) × 1835 (H) mm
Produktbeschreibung
AI Super-Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
Fünf-Sterne
100%
4 Sterne
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Alle Bewertungen
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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