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Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX8300MAX
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive ...

Produktdetails

Hervorheben:

Semiconductor AX8300MAX X-ray analyzer

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QFN internal void defect detector

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Electronics X-ray machine with warranty

Motion Control Mode: Maus & Tastatur & Joystick
Tilt And Rotation: Detektor einseitige Neigung maximal 60°
Monitor: 27-Zoll-HD-4K-Display
System OS: Windows11 64-Bit
Power Consumption: 900W
Produktbeschreibung
Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Gesamtbewertung
5.0
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★★★★★
Basierend auf 50 jüngsten Bewertungen
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  • J
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    United States Jan 21.2026
    ★★★★★
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    NICE
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