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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX8300MAX
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality ...

Produktdetails

Hervorheben:

BGA packaging inspection X-ray machine

,

CSP X-ray detector with 4K resolution

,

QFN X-ray machine with flat panel

Model: AX8300MAX
Motion Control Mode: Maus & Tastatur & Joystick
Tilt And Rotation: Detektor einseitige Neigung maximal 60°
Monitor: 27-Zoll-HD-4K-Display
System OS: Windows11 64-Bit
Power Consumption: 900W
Tube Type: Versiegelt
Produktbeschreibung
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
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5.0
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  • J
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    United States Jan 21.2026
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