logo
Willkommen bei Unicomp Technology
+86-13502802495

Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: Unicomp
Zertifizierung: CE
Modellnummer: AX9100vs
Immobilienhandel
Mindestbestellmenge: 1 Stk
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry ...

Produktdetails

Hervorheben:

BGA bumps X-ray inspection machine

,

3D X-ray machine for internal circuits

,

Unicomp AX9100vs die inspection machine

Name: Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem
Footprint: 1400(L) × 1720(W) × 1800(H) mm
Machine Weight: 2925 kg
Power: 4,5 kW
Tube Type: Geschlossen
Produktbeschreibung
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
Fünf-Sterne
100%
4 Sterne
0
3 Sterne
0
2 Sterne
0
1 Stern
0
Alle Bewertungen
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
Verwandte Produkte

Anfrage senden