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130KV 3D CT X-ray System for BGA Internal Structure Inspection Unicomp AX9100VS

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: Unicomp
Zertifizierung: CE
Modellnummer: AX9100vs
Immobilienhandel
Mindestbestellmenge: 1 Stk
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
130KV 3D CT X-ray System for BGA Internal Structure Inspection Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die ...

Produktdetails

Hervorheben:

130KV 3D CT X-ray system

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BGA internal structure inspection X-ray

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Unicomp AX9100VS X-ray machine

Name: Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem
Footprint: 1400(L) × 1720(W) × 1800(H) mm
Machine Weight: 2925 kg
Power: 4,5 kW
Produktbeschreibung
130KV 3D CT X-ray System for BGA Internal Structure Inspection Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
Fünf-Sterne
100%
4 Sterne
0
3 Sterne
0
2 Sterne
0
1 Stern
0
Alle Bewertungen
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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