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General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: Unicomp
Zertifizierung: CE
Modellnummer: AX9100vs
Immobilienhandel
Mindestbestellmenge: 1 Stk
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded ...

Produktdetails

Hervorheben:

PCBA X-ray inspection machine

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X-ray machine for solder void detection

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UNICOMP AX9100VS X-ray machine

Name: Unicomp Röntgen AX9100vs Multimode 3D Mikrofokus Röntgenanalyse Inspektionssystem
Footprint: 1400(L) × 1720(W) × 1800(H) mm
Machine Weight: 2925 kg
Power: 4,5 kW
Tube Type: Tube schließen
Produktbeschreibung
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis manipulation with any
Gesamtbewertung
5.0
★★★★★
★★★★★
Basierend auf 50 jüngsten Bewertungen
Fünf-Sterne
100%
4 Sterne
0
3 Sterne
0
2 Sterne
0
1 Stern
0
Alle Bewertungen
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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