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Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Grundlegende Eigenschaften
Herkunftsort: China
Markenbezeichnung: UNICOMP
Zertifizierung: CE, FDA
Modellnummer: AX8300
Immobilienhandel
Mindestbestellmenge: 1 Satz
Preis: can negotiate
Zahlungsbedingungen: T/T, L/C
Lieferfähigkeit: 30 Sätze pro Monat
Produktübersicht
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring ...

Produktdetails

Hervorheben:

Auto Void Detection Xray Machine

,

BGA Solder Joint Testing Equipment

,

High Motion Precision Xray Machine

Product Name: AX8300
Dimension: 1215*1325*1700 (mm)
Power Supply: 220 V, 50 Hz/60 Hz, 4 A
Weight: 1350 kg
Voltage: 110 kV
Warranty: 1 Jahr
Produktbeschreibung
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to
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5.0
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    United States Jan 21.2026
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