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x ray inspection system

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Qualität Röntgenmaschine Bombenrohr AX9100 130kV für SMT PCBA BGA leeres Maß der Inspektion und lötendes Rate lötend PTH Fabrik

Röntgenmaschine Bombenrohr AX9100 130kV für SMT PCBA BGA leeres Maß der Inspektion und lötendes Rate lötend PTH

AX9100 130kV closed tube X-Ray machine for SMT PCBA BGA soldering Void inspection and PTH soldering rate measurement Features of X-Ray machine AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-Ray machine AX9100: ●

Qualität Microfocus Unicomp AX8200MAX 5um Röntgenmaschine für Automobil-PCBA BGA QFN CSP lötende Inspektion Defekte EMS Fabrik

Microfocus Unicomp AX8200MAX 5um Röntgenmaschine für Automobil-PCBA BGA QFN CSP lötende Inspektion Defekte EMS

Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualität Röntgenprüfungs-System Bombenrohr microfocus 90KV 5um mit hoher Auflösung FPD für PCBA, das leeres Defekte checki lötet Fabrik

Röntgenprüfungs-System Bombenrohr microfocus 90KV 5um mit hoher Auflösung FPD für PCBA, das leeres Defekte checki lötet

90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD

Qualität Hohe Durchdringen-Radiographie 8KW Unicomp X Ray For Inspektion zerstörungsfreier Prüfung Fabrik

Hohe Durchdringen-Radiographie 8KW Unicomp X Ray For Inspektion zerstörungsfreier Prüfung

Cast Parts Industrial X Ray Machine Real Time Imaging Inspection UNC225 UNC225 is a robust, reliable industrial X-ray inspection system for broad applications in foundries, R&D, laboratories, universities, and educational institutions. The system delivers brilliant image quality with digital flat-panel detector and highly dynamic radioscopy. Smart ergonomics for easy operation Tailor-made configuration for wheels and tires Renowned, robust, reliable digital X-ray inspection

Qualität 160KV Inline-Ausrüstung zerstörungsfreier Prüfung zerstörungsfreier Prüfung X Ray Machine Radiography für Aluminiumrad Fabrik

160KV Inline-Ausrüstung zerstörungsfreier Prüfung zerstörungsfreier Prüfung X Ray Machine Radiography für Aluminiumrad

Unicomp Technology 160KV Inline NDT X-Ray Radiograpy system for aluminum wheel casting inspection Technical Data X-Ray Machine Dimensions:5430mmx2050mmx2410mm(L*W*H) Weight: 5T Detection range: 13~26" Load weight: 50KG Work environment: 5-40° ≦85﹪HR Install power: 380V±10% 50HZ X-Ray Tube Voltage : 160KV Power: 800W/1800W Focal Spot Size: 0.5mm FPD Detector Detector Size: 250mm×300mm Pixel matrix: 1792mm*2176mm Pixel size: 139μm Frame rate: 9 fps(1x1)30 fps(2 x 2) Unicomp

Qualität Unicomp AX8200B Größe 90kV der Knopf-Lithium-Batterie-X Ray Machine 5um Focu Scheuerschutz Fabrik

Unicomp AX8200B Größe 90kV der Knopf-Lithium-Batterie-X Ray Machine 5um Focu Scheuerschutz

Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process

Qualität Unicomp Röntgensystem AX8200max mit mehreren Messgeräten Fabrik

Unicomp Röntgensystem AX8200max mit mehreren Messgeräten

Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualität AX8200max Elektronik-Röntgenmaschine mit 6-Achsen-Rotationsfunktion Fabrik

AX8200max Elektronik-Röntgenmaschine mit 6-Achsen-Rotationsfunktion

Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualität 160KV 3D Computed Tomography X-Ray Machine Unicomp UNCT3100 For Automotive Casting Parts Non-Destructive Testing Fabrik

160KV 3D Computed Tomography X-Ray Machine Unicomp UNCT3100 For Automotive Casting Parts Non-Destructive Testing

160KV 3D computed tomography X-ray machine Unicomp UNCT3100 for automotive casting parts non-destructive testing Product Description: The UNCT3100 is one compact industrial CT inspection system that offers high precision and can be utilized across various industries to meet their specific inspection requirements. It is primarily employed for small metal castings, non-ferrous metals, lithium battery cells, chips, electronic components, rock samples, cores, soils, fossils,