industrial x ray systems
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Unicomp UNC320-Röntgenaufnahme identifiziert Mängel in Luft- und Raumfahrt-Gießkomponenten
Unicomp UNC320 X-Ray Identifies Flaws in Aerospace Die Cast Components Product Description: Primarily aimed at non-destructive testing applications, this technique is widely used in a range of products including metal castings, hardware components, plastic items, refractory materials, resin-based materials, composites, ceramic bodies, and various welded metal parts, among others. It guarantees the quality and integrity of these materials and components without causing any
Unicomp UNC320 NDT-Röntgenausrüstung zur Erkennung interner Defekte in Luft- und Raumfahrtguss
Detect Internal Defects in Aerospace Castings with Unicomp UNC320 X-Ray Product Description: Focused primarily on non-destructive testing, this technique is extensively applied to a variety of products such as metal castings, hardware components, plastic products, refractory materials, resin materials, composites, ceramics, and numerous welded metal parts, among others. It ensures the quality and soundness of these materials and components without inflicting any damage or
Unicomp UNC320 Röntgenprüfgerät zur Untersuchung verborgener Mängel von Druckgusszeugen in der Luftfahrt
Unicomp UNC320 X-Ray Inspecting Aerospace Die Castings for Hidden Defects Product Description: Centered mainly on non-destructive testing, this methodology is widely utilized across a diverse range of products, including metal castings, hardware parts, plastic items, refractory materials, resin-based materials, composites, ceramics, and various welded metal components, among others. It guarantees the quality and reliability of these materials and components without causing
225KV Spannung Unicomp UNC320 Röntgenaufnahme für die Ermittlung von Innenfehlern an der Autohalterung 7500kg Maschinengewicht
Unicomp UNC320 X-Ray for detecting internal defects in Car Bracket Product Description: This technique, which primarily focuses on non-destructive testing, is widely employed for a diverse range of products, including metal castings, hardware components, plastic items, refractory materials, resin materials, composites, ceramics, and various welded metal parts, among others. It guarantees the quality and integrity of these materials and components without causing any harm or
Erkennen Sie interne Mängel in der Fahrzeugstütze mit Unicomp UNC320 Röntgenstrahl
Detect Internal Flaws in Car Bracket with Unicomp UNC320 X-Ray Product Description: This non-destructive testing technique is broadly applied to a variety of products, such as metal castings, hardware parts, plastic goods, refractory substances, resin materials, composites, ceramics, and multiple welded metal components, among others. It ensures the quality and structural integrity of these materials and components without inflicting any damage or modifying their original
Unicomp AX9180 180kV Mikrofokus-Elektronen-Röntgenmaschine mit FPD schräg
Unicomp AX9180: 180-kV-Mikrofokus-Röntgengerät mit 10 μm Punktgröße, 60° Neigung und 7-Achsen-Verbindung. Das hochauflösende FPD bietet eine 1000-fache Vergrößerung für eine präzise PCB-, BGA- und Halbleiterinspektion. Inklusive 1 Jahr Garantie und Offline-Programmierung.
Hohe Bewegungspräzision 5μm Mikro-Fokus BGA QFN Elektronik Röntgengerät AX7900 Unicomp Qualitätskontrolle
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option
CX3000 Entdeckungs-Maschine der Elektronik-PCBA Unicomp X Ray, Maschine Benchtop X Ray
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto
Röntgenstrahl-Entdeckungs-Ausrüstungs-Elektronik SMTs BGA der hohen Leistung Halbleiter
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
