logo
Willkommen bei Unicomp Technology
+86-13502802495
Gefunden 438 Produkte für "

bga x ray inspection system

"
Qualität Real Time Unicomp X Ray Machine AX8200MAX 5 Micron Closed Tube für SMT EMS BGA Void Check Fabrik

Real Time Unicomp X Ray Machine AX8200MAX 5 Micron Closed Tube für SMT EMS BGA Void Check

Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD

Qualität Ems-SMT Lücke zerstörungsfreier Prüfung PWB-Elektronik-X Ray Machine BGA QFN LED lötende Inspektions-Ausrüstung Fabrik

Ems-SMT Lücke zerstörungsfreier Prüfung PWB-Elektronik-X Ray Machine BGA QFN LED lötende Inspektions-Ausrüstung

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic

Qualität Offline-Maß AX8200Max SMT EMS X Ray Machine Auto Mapping Fabrik

Offline-Maß AX8200Max SMT EMS X Ray Machine Auto Mapping

Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot

Qualität Unicomp AX9100max Röntgenmaschine 130kV 65W für BGA Fabrik

Unicomp AX9100max Röntgenmaschine 130kV 65W für BGA

Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp AX9100max X-ray Machine Functions and Features Functions and features of Unicomp AX9100max X-ray

Qualität Entdeckung SMTs EMS Inspektions-lineare Reihen-Detektor Unicomp X Ray Machine PCBA BGA Fabrik

Entdeckung SMTs EMS Inspektions-lineare Reihen-Detektor Unicomp X Ray Machine PCBA BGA

High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0℃~ 40℃ / 30 ~ 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 μA Focal Spot Size: 5 micron

Qualität Bombenrohr-Elektronik X Ray Machine AX8200B 100kv für Ausrichtungs-Inspektion Fabrik

Bombenrohr-Elektronik X Ray Machine AX8200B 100kv für Ausrichtungs-Inspektion

Digital Real Time AX8200B X Ray Machine for diamond core drill bit inner layer alignment inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process

Qualität AX8200B Unicomp X Ray Machine programmierbare Inspektion CNC für zylinderförmige Lithium-Batterie Fabrik

AX8200B Unicomp X Ray Machine programmierbare Inspektion CNC für zylinderförmige Lithium-Batterie

AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X

Qualität Lithium-Batterie-Elektronik X Ray Machine Unicomp AX8200B Fabrik

Lithium-Batterie-Elektronik X Ray Machine Unicomp AX8200B

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the

Qualität 22" Batterie Unicomp AX8200B Elektronik-X Ray Machine For Polymer Lithium Fabrik

22" Batterie Unicomp AX8200B Elektronik-X Ray Machine For Polymer Lithium

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes